Capabilities

Our Capabilities

Materials Standard Advanced Standard Features Standard Advanced
FR4 (130‐180 Tg by DSC) Y Y Maximum layer count 20 36
Halogen Free Y Y Maximum Panel Size 21″x24″ 24″x30″
BT Epoxy Y Y Outer Layer Trace/Spacing (1/3 oz) 0.0035″/0.0035″[90μm/90μm] 0.0025″/0.003″[64μm/76μm]
Getek Y Y Inner Layer Trace/Spacing (H oz) 0.003″/0.003″ [76μm/76μm] 0.002″/0.0025″ [50μm/64μm]
Isola 370HR 406 408 IS410 IS 420 IS620 Y Y Maximum PCB thickness 0.125″[3.2mm] 0.177″[4.5mm]
Nelco 4000 Y Y Minimum PCB thickness 0.008″[0.20mm] 0.004″[0.10mm]
Rogers 4000 Y Y Minimum mechancial drill size 0.008″[0.20mm] 0.004″[0.10mm]
PTFE Y Y Maximum PCB aspect ration 10:01 12:01
Dupont Pyralux N Y Maximum copper weight 5 oz [178μm] 6 oz [214μm]
Aluminum Core Y Y Minimum copper weight 1/3 oz [12μm] 1/4 oz [9μm]
Minimum core thickness 0.002″[50μm] 0.0015″[38μm]
Minimum dielectric thickness 0.0025″[64μm] 0.0015″[38μm]
Surface Finishes Minimum Pad Size over Drill 0.018″[0.46mm] 0.016″[0.4mm]
ENIG Y Y Solder Mask Registration +/‐ 0.002″[50μm] +/‐ 0.0015″[38μm]
Flash Gold Y Y Mimimum Solder Mask Dam 0.003″[76μm] 0.0025″[64μm]
Electrolytic Nickel/Hard Gold Y Y Copper feature to PCB edge 0.015″[0.38mm] 0.010″[0.25mm]
HASL Y Y Tolerance on overall dimensions +/‐ 0.004″[100μm] +/‐ 0.002″[50μm]
Lead Free HASL Y Y
Immersion Ag Y Y HDI Features Immersion Tin Y Y Capture pad size 0.010″[0.25mm] 0.009″[0.22mm] OSP Y Y Glass reinforced dielectrics Y Y Selective & Multiple Surface Finishes Y Y Maximum aspect ratio 0.6:1 1:01 Electrolytic Soft Gold N Y Minimum microvia hole size 0.004″[100μm] 0.003″[75μm] Carbin Ink Y Y Stacked Microvias Y Y Peelable Solder Mask / Kapton Tape Y Y Copper Filled Microvias Y Y Maximum No. of buildup layer 3+N+3 4+N+4 PCB Technologies Buried and Blind Microvias Y Y Quality System and Certificates Sequential lamination Y Y IPC‐600, 6012, Class II and III Mixed dielectric / Hybrid construction Y Y ISO 9001:2008 Aluminum Back PCB Y Y TS 16949:2009 Buried Capacitance N Y UL: E229342 PCB w/Cavity N Y Conductive hole fill Y Y Shenzhen Headquarters: Non‐conductive hole fill Y Y B Building Shangxing No.2 Industry District, Shajing Town Countersink Y Y Baoan, Shenzhen, Guangdong 518125, China Depth Control Drill and Rout Y Y Tel: +86‐755‐27243597 Fax: +86‐755‐27243642 www.sunshinepcb.com Edge Milling Y Y Etch Back Y Y US Office: Impedance +/‐ 10% +/‐ 5% 3400 Silverstone Drive, Suite 139, Plano, TX 75023 Scoring and PCB edge Beveling Y Y Tel: 972‐867‐8886 Fax: 972‐867‐8002 In‐board Beveling Y Y

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