Rigid-Flex PCB technology offers many benefits. First, it allows the designer to consider 3-dimensional designs that wrap around mechanical housings or fit into tight spaces. Rigid FR4 areas are combined with flexible polyimide areas to form one integrated assembly. By reducing the number of connections or solder joints, this technology can reduce assembly costs and improve reliability. Removing connectors can also lower the weight and z-axis height of the assembly.
Rigid technology was initially used in the military and aerospace industries. Over the past 25-30 years, Rigid-Flex have seen increased application in medical, automotive, industrial, telecommunications, and consumer electronics.
Sunshine Global support adhesiveless and adhesive-based materials from Panasonic and Shengyi. Typical material thicknesses are 25 and 50 um polyimide (PI) with H, 1, or 2 oz copper. Coverlayers are made of polyimide with 12.5 to 25 um thickness and 15 to 35 um of adhesive. The copper may be standard HTE foil for static or bend-to-install applications, or rolled annealed (RA) copper for dynamic-flex applications.
Processing of Rigid-Flex is complex and requires the use of no-flow prepregs or other special materials. Since there are more steps compared with rigid boards, the cycle-time and cost may be higher. It is important for the designer to engage with us early in the design phase so we can help with material selection and design guidelines.
Sunshine Global has been building Rigid-Flex for over 10 years. The highest technology we have built so far is 14 layers with HDI. We have a dedicated manufacturing line for Rigid-Flex and Flexible Circuits, along with dedicated engineers and product development team. Please see table for details regarding our capabilities.